View HSDL-3612-007_4540552.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

applications ?f digital f imagingf ffffffCf fdigitalfstillf camerasf f f ffffffCf fphoto-imagingf printers ?f data f communicationf f f ffffffCf fnotebookf computersf f f ffffffCf fdesktopf pcsf f f ffffffCf fwinfcefhandheldf productsf f ffffffCf fpersonalf digitalf assistantsf (pdas)f f ffffffCff printersf f f f f C f ffaxf machines,f photocopiersf f f C f fscreenf projectorsf f f f C f fautof pcsf f f f f C f fdonglesf f f f f C f fset-topf box ?f telecommunication f productsf f f C f fcellularf phonesf f f f C f fpagers ?f small f industrialf&fmedicalf instrumentationf f C f fgeneralf dataf collectionf devices f C f fpatientf&f pharmaceuticalf dataf collectionf devices functional block diagram hsdl-3612 irda? data compliant 115.2 kb/s 3 v to 5 v infrared transceiver data sheet description the f hsdl-3612 f is f a f low-profile f infrared f transceiver f modulef that f provides f interface f between f logic f andf irf signals f forf through-air,f serial,f half-duplexfirf dataf link.f the f modulef isf compliant f to f irda f data f physical f layer f specifcations f1.4fandf iec825-classf1f eyef safe. features ?f fully f compliantf tof irdaf1.0f physicalf layerfspecifca - tionsf C f9.6f kb/sf tof115.2f kb/sf operation ?f typical flinkf distancef>f1.5fm ?f iec825-class f1f eyef safe ?f low f powerf operationf rangefCf2.7f vf tof5.25f v ?f small fmodulef sizefCf4.0fxf12.2fxf5.1fmmf (hxwxd) ?f complete f shutdownfCf txd, f rxd,fpinfdiode ?f low f shutdownf currentfCf10fnaf typical ?f adjustable fopticalf powerf managementfCf adjustablef ledf drive-currentf tof maintainflinkf integrity ?f integrated femifshieldfCf excellentfnoisef immunity ?f edge f detectionfinputfCf preventsfthefledf fromflongff turn-on ftime ?f interface f tof variousfsuperfi/ofandf controllerf devices ?f designed f tof accommodatef lightflossfwithf cosmeticf window ?f only f2f externalf componentsf aref required ?f lead f freef package txd (9) md0 (4) md1 (5) gnd (7,3) agnd (2) v cc (1) r1 v cc sp hsdl-3612 cx1 cx2 leda (10) rxd (8)
2 the f hsdl-3612 f contains f a f high-speed f and f high-ef - ciency f 870f nmf led, f af silicon f pinf diode, f andf anf integrat - edf circuit. f the f icf contains f anf ledf driver f andf af receiver f providing f af singlef outputf (rxd) f for f allf data f rates f sup - ported. the f hsdl-3612 f canf bef completely f shutf down f to f achieve f very f low f power f consumption. f in f thef shutf down f mode, f thef pinf diodef willf bef inactive f andf thusf producing f very f little f photo-current f even f under f very f bright f ambient f light. f the f hsdl-3612 f alsof incorporated f thef capability f for f adjustable f optical f power. f with f two f programming f pins;f modef 0f andf modef 1,f thef opticalf power f outputf canf bef adjusted f lower f whenf thef nominalf desired f linkf distance fisf one-thirdforf two-thirdfofftheffullf irdaf link. the f hsdl-3612 f front f view f options f (HSDL-3612-007/- 037) f and f a f top f view f packaging f option f (hsdl-3612- 008/-038) f come f with f integrated f shield f that f helps f to f ensure f low f emi f emission f and f high f immunity f to f emi f feld, fthusfenhancingf reliablef performance. application support information the f application f engineering f group f isf available f to f assistf you f withf thef technical f understandingf associated f withf hsdl-3612 f infrared f transceiver f module. f you f canf contact f themf through f your f localf salesf representatives f for f ad - ditionalf details. ordering information package option package part number standard package increment f front f viewf HSDL-3612-007f 400 f f f f f f f f f f f f f front f viewf hsdl-3612-037f 1800 f f f f f f f f f f f f f top f viewf hsdl-3612-008f 400 f f f f f f f f f f f f f f f f f f f f f f f f f f f f f top f viewf hsdl-3612-038f 1800 f f f f f f f f f f f f f f f f f f f f f f f f f f f f f
3 i/o pins confguration table pin description symbol f 1f supply f voltagef v cc f 2f analog f groundf agnd f 3f groundf gnd f 4f mode f0f md0 f 5f mode f1f md1 f 6f no f connectionf nc f 7f groundf gnd f 8f receiver f dataf outputf rxd f 9f transmitter f dataf inputf txd f 10f led f anodef leda f transceiver i/o truth table transceiver inputs outputs mode txd ei led rxd f activef f 1f fffffffffffffffffffffffff xf f f onf f fffffffffnotf valid f activef f 0f fffffffffffffffffffffffff high [1] f f off f fffffffff low [2] f activef f 0f fffffffffffffffffffffffff lowff f off f fffffffff high f shutdownf f x [3] f fffffffffffffffffffffffff lowff f notf validf fffffffffnotf valid xf=f dontf caref eif=f in-bandf infraredf intensityf atf detector notes: 1.f in-band felff115.2f kb/s. 2.f logic f lowfisfafpulsedf response.f the f conditionfisf maintainedf forf durationf dependentfonfthef patternfandf strengthfoffthef incidentf intensity. 3.f to f maintainf lowf shutdownf current,f txd fneedsf tofbef drivenfhighforf lowfandfnotf leftf foating. transceiver control truth table mode 0 mode 1 rx function tx function f 1f f 0f f shutdownf f shutdown f 0f f 0f f sirf f f full f distancef power f 0f f 1f f sirf f f 2/3 f distancef power f 1f f 1f f sirf f f 1/3 f distancef power f 8 7 6 5 4 3 2 1 9 10 back view (HSDL-3612-007/-037) 8 7 6 5 4 3 2 1 9 10 bottom view (hsdl-3612-008/-038)
4 recommended application circuit components component recommended value f r1f 6.2f?ff5%,f0.5f watt, f forf2.7ff v cc ff3.6f vf operationf f f f 15.0f?ff5%,f0.5f watt, f forf4.75ff v cc ff5.25f vf operation f cx1 [4] f 0.47ffff20%,fx7rf ceramic f cx2 [5] f 6.8ffff20%,f tantalum notes: 4.fcx1fmustfbef placedfwithinf0.7fcmfoffthef hsdl-3612f tofobtainfoptimumfnoisef immunity. 5.fin f hsdl-3612 f functionalfblockf diagram fonfpagef1fitfisfassumedf thatf vled fandf v cc f sharefthefsamefsupplyf voltagefandf flterf capacitors.f infcasef thef2fpinsf aref poweredf byf diferentfsuppliesfcx2fisfapplicablef forf vled fandfcx1f forf v cc .f inf environmentsfwithfnoisyf powerf supplies,fincludingf cx2fonfthef v cc flinefcanf enhancefsupplyf rejectionf performance. iled vs. leda. light output power (lop) vs. iled. marking information the f HSDL-3612-007/-037 f is f marked f 3612yyww f on f thef shieldf where f yy f indicates f thef units f manufactur - ingf year, f andf ww f refers f to f thef work f week f inf whichf thef unitfisf tested. cautions: the bicmos inherent to the design of this component increases the components susceptibility to dam - age from electrostatic discharge (esd). it is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by esd. iled (a) 0.7 leda voltage (v) 0.3 1.7 2.1 0 0.1 1.3 2.3 0.5 1.5 1.9 0.6 0.4 0.2 lop (mw/sr) 200 iled (ma) 80 120 270 0 20 0 300 160 30 150 180 120 40 100 60 90 180 60 210 240 140
5 absolute maximum ratings [6] parameter symbol minimum maximum unit conditions f storage f temperaturef t s f C40f +100f cf f operating f temperaturef t a f C20f +70f cf f dc fledf currentf i led (dc)f f 165f maf f peak fledf currentf i led (pk)f f 750f maf f2fsfpulsefwidth,f f f f f f f f f10%f dutyf cycle f led f anodef voltagef v leda f C0.5f 7f vf f supply f voltagef vccf 0f 7f vf f transmitter f dataf i txd (dc)f C12f 12f ma f f input f currentf f receiver f datafff v o f C0.5f vcc+0.5f vf |i o (rxd)| f=f20fa f f output f voltage note: 6.f forf implementationsf wherefcasef tof ambientf thermalf resistanceff 50c/w. recommended operating conditions parameter symbol minimum maximum unit f operating f temperaturef t a f C20f +70f cf f supply f voltagef v cc f 2.7f 5.25f vf f logic f highf inputf voltagef f v ih f f2f v cc /3f f v cc f f v f f for f txd, fmd0,fmd1,fandffir_selff f f f logic f lowf transmitter f inputf voltage fff f v il f f0f f v cc /3f f v f led f (logicf high)f currentf pulsef amplitudef f i leda f 180f 300f ma f receiver f signalf ratef f 2.4f 115.2f kb/sf f
6 electrical & optical specifcations specifcations fholdf overfthef recommendedf operatingf conditionsfunlessf otherwisef noted.funspecifedf testf condi - tionsfcanfbef anywherefinftheirf operatingf range.f allf typicalf valuesf aref atf25cfandf3.3f vfunlessf otherwisef noted. parameter symbol min. typ. max. unit conditions f transceiver f supply f f shutdownf i cc1 f f 10f 200f naf v i (txd) ff v il forf f f currentf f f f f f f v i (txd) ff v ih f f idlef i cc2 f f 2.5f 5f maf v i (txd) ff v il ,feif=f0 f digital f inputf f logicff i l/h f C1f f 1f af 0 ff v i ff v cc f f currentf low/high f transmitter f transmitterf logic f highf f ei h f 50f 120f 400f mw/srf v ih f=f3.0f vf f f radiantf intensityf f f f f f i leda f=f200fmaf f f intensityf f f f f f f 1/2 ff15 f f peak ff p f f 875f f nm f f f wavelengthf f f spectral f f ? 1/2 f f 35f f nm f f f linefhalff f f f widthf f f viewing f anglef 2 1/2 f 30f f 60f f f f opticalf pulsef f tpwf (ei)f 1.5f 1.6f 1.8f sf tpw(txd)f=f1.6fsf atf f f f widthf f f f f f 115.2 f kb/s f f rise fandf fallf f t r f(ei),f f f f 40f nsf tpw(txd)f=f1.6fsf atf f f f timesf t f f (ei)f f f f f 115.2f kb/sf f f f f f f f f f t r/f (txd) f=f10fns f f maximum f f tpwf (max)f f 20f 50f sf txdfpinfstuckfhigh f f f opticalf pulsef f f f width f led f anodeff f f v on (leda)f f f 2.4f vf i leda f=f200fma,f f f on f statef voltagef f f f f f f v i (txd) ff v ih f led f anodeff f f i lk (leda)f f 1f 100f naf v leda f=f v cc f = f5.25f v, f f of f statef leakagef currentf f f f f f v i (txd) ff v il
7 electrical & optical specifcations specifcations fholdf overfthef recommendedf operatingf conditionsfunlessf otherwisef noted.funspecifedf testf condi - tionsfcanfbef anywherefinftheirf operatingf range.f allf typicalf valuesf aref atf25cfandf3.3f vfunlessf otherwisef noted. parameter symbol min. typ. max. unit conditions f receiver f receiver f f logicf low [7] f f v ol f 0f -f 0.4f vf i olf =f1.0fma,f f f data f outputf f f f f f f f eiff3.6fw/cm 2 ,ff f f voltagef f f f f f f 1/2 ff15 f f logic f highf v oh f v cc fCf 0.2f -f v cc f vf i ohf =fC20fa,f f f f f f f f f f eiff0.3fw/cm 2 ,ff f f f f f f f f f 1/2 ff15 f f viewing f anglef 2 1/2 f 30f f f f f logic f highf receiverf inputf f ei h f 0.0036 f f f 500f f mw/cm 2f f for fin-bandf signalsf f f irradiancef f f f f f f 115.2f kb/s [8] f logic f lowf receiverf inputf f ei l f f f 0.3f w/cm 2 f for fin-bandf signals [8] f f irradiance f receiver f peakf sensitivityf f p f f 880f f nm f f wavelengthf f receiver fsirf pulsef widthf tpw f (sir)f 1f f 4.0f sf 1/2 f ff15 [9] ,fc l f = f10ffpf f receiver f latencyf timef t l f f 20f 50f sf f receiver f rise/fallf timesf t r/f f (rxd)f f 25f f nsf f receiver f wake fupf timef t w f f f 100f sf [10] notes: f 7. f flogicf lowfisfafpulsedf response.f the f conditionfisf maintainedf forf durationf dependentfonf patternfandf strengthfoffthef incidentf intensity. f 8.f an fin-bandfopticalf signalfisfaf pulse/sequencef wherefthefpeakf wavelength,f lp,fisfdefnedfasf850fflpff900fnm,fandfthefpulsef characteristicsf are f compliantfwithfthef irdaf serialf infraredf physicalf layerflinkf specifcation. f 9.f for fin-bandf signalsff115.2f kb/sf wheref3.6fw/cm 2 ffeiff500fmw/cm 2 . f10.f wake fupf time fisftheftimef betweenfthef transitionf fromfaf shutdownf statef tofanf activef statefandftheftimefwhenfthef receiverfisf activefandf ready f tof receivef infraredf signals.
8 rxd output waveform led optical waveform receiver wake up time defnition (when md0 1 and md1 0) txd stuck on protection t pw (max.) txd led t f v oh 90% 50% 10% v ol t pw t r t f led off 90% 50% 10% led on t pw t r rx light t w rxd valid data
9 HSDL-3612-007 and hsdl3612-037 package outline with dimension and recommended pc board pad layout pin 1 mounting center 6.10 4.18 4.00 12.20 3.84 r 1.77 r 2.00 4.05 4.95 10 castellation: pitch 1.1 0.1 cumulative 9.90 0.1 0.70 0.80 1.70 pin 10 0.45 1.20 0.80 2.45 1.90 3.24 1.90 4.98 mid of land 1.05 2.40 2.35 2.84 2.08 0.70 0.43 pin 10 pin 1 mounting center top view front view land pattern back view side view all dimensions in millimeters (mm) . dimension tolerance is 0.20 m m unless otherwise specified. 1.17 pin 1 2 3 4 5 v cc agnd gnd md 0 md 1 pin 6 7 8 9 10 nc gn d rxd txd leda function function
10 hsdl-3612-008 and hsdl3612-038 package outline with dimension and recommended pc board pad layout 3.85 0.47 0.36 0.83 0.42 0.94 0.31 0.84 0.53 0.31 0.28 1.77 2.15 +0.05 - 0.00 12.2 +0.10 - 0.00 4.16 +0.05 - 0.00 11.7 +0.05 - 0.00 2.5 5 11.7 0.85 0.3 2.08 1.46 2.57 3.84 3.24 5 5 2.08 r2.3 r2.1 0.1 0.1 4.65 r2 r1.77 0.8 0.73 0.94 1.95
11 tape and reel dimensions (HSDL-3612-007, -037) all dimensions in millimeters (mm) r 1.00 2.00 0.50 label empty parts mounted leader empty (400 mm min. ) (40 mm min.) direction of pulling (40 mm min.) configuration of tape 13.00 0.50 shape and dimensions of reels quantity = 400 pieces per reel (HSDL-3612-007) 1800 pieces per tape (hsdl-3612-037) 21.00 0.80 12.50 0.10 8.00 0.10 4.00 0.10 24.00 0.30 1.75 0.10 0.40 0.10 4.25 0.10 ?1.55 0.05 11.50 0.10 2.00 0.10 b b 5 (max.) 5 (max.) 5.20 0.10 a a section a-a section b- b 10 3.8 a a ?1.5 0.1 10 11 12 8 7 3 2 1 4 5 6 4.4 9 a a a
12 tape and reel dimensions (hsdl-3612-008, -038) all dimensions in millimeters (mm) r 1.00 2.00 0.50 label empty parts mounted leader empty (400 mm min. ) (40 mm min.) direction of pulling (40 mm min.) configuration of tape 13.00 0.50 shape and dimensions of reels quantity = 400 pieces per reel (hsdl-3612-008) 1800 pieces per tape (hsdl-3612-038) 21.00 0.80 bo w e t ko f b do p2 d1 po p1 5.4 0.15 symbol spec symbol spec ao 4.4 0.10 bo 12.50 0.10 ko 4.85 0.10 po 4.0 0.10 p1 8.0 0.10 p2 2.0 0.10 t 0.35 0.10 e 1.75 0.10 f 11.5 0.10 do 1.55 0.10 d1 1.5 0.10 w 24.0 0.3 10po 40.0 0.20 b 5 (max.) 5 (max.) a a section a-a notes: 1. i.d. sprocket hole pitch cumulative tolerance is 0.2 mm. 2. corner camber shall be not more than 1 mm per 100 mm through a length of 250 mm. 3. ao and bo measured on a place 0.3 mm above the bottom of the pocket. 4. ko measured from a place on the inside bottom of the pocket to top surface of carrier. 5. pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. section b-b 8 0.10 ao
13 baking conditions if f thef parts f are f notf stored f inf dry f conditions, f theyf mustf befbakedf beforef refowf tof preventfdamagef tofthef parts. package temp. time f ffff inf reelsf f 60cf f f48fhours f ffff inf bulkf f 100cf f f4fhoursf ff f 125c f f f2fhoursf ff f 150c f f f1fhour baking fshouldfbefdonefonlyf once. recommended storage conditions f storagef 10c f tof30c f f temperaturef f relativef below f60%frh f f humidity time from unsealing to soldering after f removal f from f thef bag, f thef parts f shouldf bef sol - dered f withinf three f days f iff stored f at f thef reco mmendedf storage f conditions. f if f times f longer f than f 72 f hours f are f needed, fthef partsfmustfbef storedfinfaf dryf box. moisture proof packaging all f hsdl-3612 f optionsf are f shippedf inf moisture f proof f package. f oncef opened,f moisturef absorptionf begins. units in a sealed moisture-proof package package is opened (unsealed) environmen t less than 30 c, and less than 60% rh package is opened less than 72 hours perform recommended baking conditions no baking is necessary yes no no yes
14 the f refow f profle f isf af straight-line f representation f off af nominalf temperature f profle f for f af convective f refow f sol - derf process. f the f temperature f profle f isf dividedf into f four f process f zones, f eachf withf diferent f ? t/ ? timef tempera - ture f changef rates. f the f ? t/ ? timef rates f are f detailedf inf thef above f table. ff the f temperatures f are f measured f at f thef component f tof printedf circuitf boardf connections. in f process zone p1 ,f thef pcf board f andf hsdl-3612 f cas - tellation f pinsf are f heated f to f af temperature f off 160cf to f activate f thef fuxf inf thef solderf paste. f the f temperature f ramp f upf rate, f r1,f isf limited f to f 4cf perf second f to f allow f for f even f heating f off bothf thef pcf board f andf hsdl-3612 f castellations. process zone p2 f shouldf bef off sufcient f timef duration f (60f to f 120f seconds) f to f dry f thef solderf paste. f the f tem - perature f isf raised f to f af level f justf below f thef liquidusf point f offthef solder,fusuallyf200cf(392f).f process zone p3 f isf thef solderf refow f zone. f in f zone f p3,f the f temperature f is f quickly f raised f above f the f liquidus f point f off solderf to f 255cf (491f)f for f optimumf results. f the f dwell f timef above f thef liquidusf point f off solderf shouldf bef between f 20f andf 60f seconds. f it f usuallyf takesf aboutf 20f seconds f to f assure f proper f coalescing f off thef solderf ballsf into f liquidf solderf andf thef formation f off goodf solderf connections. f beyond f af dwell f timef off 60f seconds, f thef intermetallic f growth f withinf thef solderf connections f be - comes f excessive, f resulting f inf thef formation f off weak f andf unreliable f connections. f the f temperature f isf thenf rapidly f reduced f to f af point f below f thef solidusf temperature f off thef solder, f usuallyf 200cf (392f),f to f allow f thef solderf withinf thef connectionsf tof freezef solid.f process zone p4 f isf thef cool f down f after f solderf freeze. f the f cool f down f rate, f r5,f from f thef liquidusf point f off thef solderf to f 25cf (77f)f shouldf notf exceed f 6cf perf second f maximum.f this f limitation f isf necessary f to f allow f thef pcf board f andf hsdl-3612 f castellations f to f changef dimen - sions f evenly, f putting f minimal f stresses f on f the f hsdl- 3612f transceiver. recommended refow profle process zone symbol d t maximum d t/ d time f heat fupf p1,fr1f 25cf tof160cf 4c/s f solder f pastef dryf p2,fr2f 160cf tof200cf 0.5c/s f f p3,fr3f 200cf tof255cff 4c/sfff f f solder f refowf f (260cf atf10f secondsfmax.)f f f f p3,fr4f 255cf tof200cf -6c/s f cool f downf p4,fr5f 200cf tof25cf -6c/s 0 t-time (seconds) t C temperature C ( c) 200 170 125 100 50 50 150 100 200 250 300 150 183 230 p1 heat up p2 solder paste dry p3 solder reflow p4 cool down 25 r1 r2 r3 r4 r5 90 sec. max. above 183 c max. 245 c
15 appendix a: HSDL-3612-007/-037 smt assembly application note 1.0fff solderf pad,f maskfandf metalf solderf stencilf aperture 1.1 recommended land pattern for HSDL-3612-007/-037 figure 1.0. stencil and pcba. figure 2.0. top view of land pattern. dim. mm inches f af f 2.40f f 0.095 f bf f 0.70f f 0.028 f c f (pitch)f f 1.10f f 0.043 f df f 2.35f f 0.093 f ef f 2.80f f 0.110 f ff f 3.13f f 0.123 f gf f 4.31f f 0.170 metal stencil for solder paste printing land pattern pcba stencil aperture solder mask shield solder pad a b f theta 10x pad y d e g rx lens tx lens fiducial x c fiducial
16 1.2 adjacent land keep-out and solder mask areas dim. mm inches f hf min. f 0.2f min.f0.008 f jf 13.4f 0.528 f kf 4.7f 0.185 f lf 3.2f 0.126 ?f adjacent f landf keep-out f isf thef maximum space f oc - cupiedf by f thef unitf relative f to f thef landf pattern. f there f should f be f no f other f smd f components f within f this f area. ?f h f isf thef minimumf solderf resist f strip f widthf required f to f avoidfsolderf bridgingf adjacentf pads. ?f it f isf recommended f that f 2f fducialf cross f bef placed f at f mid-lengthfoffthefpadsf forfunitf alignment. note: f wet/liquid f photo-imaginablefsolderf resist/maskfisf recommended. figure 3.0. HSDL-3612-007/-037 pcba C adjacent land keep-out and solder mask. 2.0 recommended solder paste/cream volume for castellation joints basedf onf calculation f andf experiment, f thef printed f solderf paste f volume f required f perf castellation f padf isf 0.30f cubicf mmf (basedf onf eitherf no-clean f orf aqueousf solderf cream f types fwithf typicallyf60f tof65%fsolidf contentf byf volume). h l rx lens tx lens dim . m m i nches h j k l min. 0.2 13.4 4.7 3.2 min. 0.008 0.528 0.185 0.126 j solder mask land k ? adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern . there should be no other sm d components within this area. ? "h" is the minimum solder resist strip width required to avoid solder bridging adjacent pads. ? it is recommended that 2 fiducial cross be placed at mid-length of the pads for unit alignment. y
17 allowable misalignment tolerance f x fCf directionfffffffffffffffffffffffffffffffff0.2fmmf(0.008finches) f theta fCf directionfffffffffffffffffffffffff2f degrees 2.1 recommended metal solder stencil aperture it f isf recommended f that f onlyf 0.152f mmf (0.006f inches)f orf 0.127f mmf (0.005f inches)f thickf stencil f bef usedf for f solderf paste f printing. f this f isf to f ensure f adequate f printed f solderf paste f volume f andf nof shorting. f the f following f combina - tionf off metalf stencil f aperture f andf metalf stencil f thick - nessfshouldfbefused: 3.0 pick and place misalignment tolerance and product self-alignment after solder refow if f thef printed f solderf paste f volume f isf adequate, f the unit will self-align f in f the f x-direction f after f solder f refow. f unitsf shouldf bef properly f refowed f inf irf hotf air f convec - tionf oven f usingf thef recommended f refow f profle. f f the f direction foff boardf travelfdoesfnotf matter. see fig 4.0 t, nominal stencil thickness l, length of aperture mm inches mm inches f 0.152f 0.006f 2.8ff0.05f 0.110ff0.002 f 0.127f 0.005f 3.4ff0.05f 0.134ff0.002 w, ffthefwidthfoff aperturefisf fxedf atf0.70fmmf(0.028finches) aperture fopeningf forfshieldfpadfisf2.8fmmfxf2.35fmmfasfperflandfdimensions figure 4.0. solder paste stencil aperture. aperture as per land dimensions solder paste l w t (stencil thickness)
18 3.1 tolerance for x-axis alignment of castellation misalignment f off castellation f to f thef landf padf shouldf notf exceed f 0.2f mmf orf approximately f halff thef widthf off thef castellation f during f placement f off thef unit. f f the f castel - lations f will f completely f self-align f to f the f pads f during f solderf refowfasfseenfinfthef picturesf below. photo 2.0. castellation self-align to land pads after refow. photo 3.0. unit is rotated before refow. 3.2 tolerance for rotational (theta) misalignment unitsf whenf mounted f shouldf notf bef rotated f more f thanf f 2f degrees f withf reference f to f center f x-y f asf specifedf inf fig f 2.0.f pictures f 3.0f andf 4.0f show f unitsf before f andf after f refow. ff unitsf withf af theta f misalignment f off more f thanf 2f degrees f dof notf completely f selff align f after f refow. f unitsf withf f 2f degree f rotational f orf theta f misalignment f self- aligned f completelyf afterfsolderf refow. photo 1.0. castellation misaligned to land pads in x-axis before refow. photo 4.0. unit self-aligns after refow.
19 3.3 y-axis misalignment of castellation in f thef y-direction, f thef unitf doesf notf self-align after f sol - derf refow . it f isf recommended f that f thef unitf bef placed f inf linef withf thef fducialf mark f (mid-lengthf off landf pad.) f this f willf enablef sufcient f landf lengthf (minimumf off 1 / 2 f landflength.)f tof formfafgoodf joint.f seef figf5.0. figure 5.0. section of a castellation in y-axis. photo 5.0. good solder joint. 3.4 example of good HSDL-3612-007/-037 castella - tion solder joints this f joint f is f formed f when f the f printed f solder f paste f volume f isf adequate, f i.e. f 0.30f cubicf mmf andf refowed f properly. f it f shouldf bef refowed f inf irf hot-air f convection f refow f oven.f directionfoff boardf travelfdoesfnotf matter. 4.0 solder volume evaluation and calculation geometry foffanf HSDL-3612-007/f-037fsolderf fllet. minimum 1/2 the length of the land pad lens edge fiducial y 0.8 1.2 0.70 0.425 0.20 0.7 0.4
20 dim. mm inches f af f 1.95f f 0.077 f bf f 0.60f f 0.024 fcf (pitch)f f 1.10f f 0.043 f df f 1.60f f 0.063 f ef f 5.70f f 0.224 fff f f 3.80f f 0.123 fgf f f 2.40f f 0.170 f appendix b: hsdl-3612-008/-038 smt assembly application note 1.0.f solderf pad,f mask,fandf metalf solderf stencilf aperture figure 1. stencil and pcba. 1.1.f recommendedflandf patternf forf hsdl-3612-008/-038 metal stencil for solder paste printing land pattern pcba stencil aperture solder mask shield solder pad a b theta 10x pad y d e g tx lens rx lens fiducial x c fiducial h f
21 2.0 y-axis misalignment of castellation in f thef y-direction, f thef unitf doesf notf self-align f after f sol - derf refow. f it f isf recommended f that f thef unitf bef placed f inf linef withf thef fducialf mark f (mid-lengthf off landf pad).f this f willf enablef sufcient f landf lengthf (minimumf off 1 / 2 f landf length)f tof formfafgoodf joint.f seef figuref2. figure 2. section of a castellation in y-axis. y 1/2 the length of the castella tion p ad fiducial
22 to f ensure f irda f compliance, f some f constraints f on f the f height f andf widthf off thef window f exist. f the f minimumf dimensionsf ensure f that f thef irda f cone f anglesf are f metf without f vignetting. f the f maximum f dimensions f mini - mize f thef efects f off stray f light. f the f minimumf size f cor - responds f to f af cone f anglef off 30 0 f andf thef maximumf size f corresponds f tofaf conefanglefoff60 o .f f in f thef fgure f below, f xf isf thef widthf off thef window, f yf isf thef height f off thef window f andf zf isf thef distance f from f thef hsdl-3612 f to f thef backf off thef window. f the f distance f from f thef center f off thef ledf lensf to f thef center f off thef photodiode f lens, f k, f isf 7.08mm.f the f equations f for f com - putingfthef windowfdimensionsf arefasf follows: xf=fkf+f 2*(z+d)*tana f yf=f 2*(z+d)*tanaf f f f f f f appendix c: optical port dimensions for hsdl-3612: the f above f equations f assumef that f thef thickness f off thef window f isf negligible f compared f to f thef distance f off thef modulef from f thef backf off thef window f (z).f if f theyf are f comparable, f z f replaces f zf inf thef above f equation. f f z f isf defnedfasf z=z+t/nf f f f f where f t f isf thef thickness f off thef window f andf n f isf thef re - fractive f indexfoffthef windowf material. the f depthf off thef ledf imagef insidef thef hsdl-3612, f d, f isf 8mm.f a f isf thef required f halff anglef for f viewing. f for f irda f compliance, f thef minimumf isf 15 0 f andf thef maximumf isf 30 0 .f assuming f thef thickness f off thef window f to f bef neg - ligible, f thef equations f result f inf thef following f tablesf andf graphs: section of a castellation in y-axis.
23 aperture width aperture height (x, mm) (y, mm) module depth, (z) mm max. min. max. min. f 0f f 16.318f 11.367f ff 9.238f f 4.287 f 1f f 17.472f 11.903f ff 10.392f f 4.823 f 2f f 18.627f 12.439f ff 11.547f f 5.359 f 3f f 19.782f 12.975f ff 12.702f f 5.895 f 4f f 20.936f 13.511f ff 13.856f f 6.431 f 5f f 22.091f 14.047f ff 15.011f f 6.967 f 6f f 23.246f 14.583f ff 16.166f f 7.503 f 7f f 24.401f 15.118f ff 17.321f f 8.038 f 8f f 25.555f 15.654f ff 18.475f f 8.574 f 9f f 26.710f 16.190f ff 19.630f f 9.110
window material almost f any f plasticf material f willf work f asf af window f mate - rial. f polycarbonate f isf recommended. f the f surface f fnishf off thef plasticf shouldf bef smooth,f withoutf any f texture. f an f irf flter f dye f may f bef usedf inf thef window f to f makef itf lookf blackf to f thef eye, f butf thef total f opticalf lossf off thef window f shouldf bef 10f percent f orf lessf for f bestf opticalf performance. f lightflossfshouldfbef measuredf atf875fnm.f f f f f flat window (first choice) curved front and back (second choice) curved front, flat back (do not use) shape of the window from f anf opticsf standpoint, f thef window f shouldf bef fat. f this f ensures f that f thef window f willf notf alter f eitherf thef ra - diation f pattern f off thef led, f orf thef receive f pattern f off thef photodiode.f f f f f if f thef window f mustf bef curved f for f mechanicalf orf indus - trial f design f reasons, f place f thef samef curve f onf thef backf sidef off thef window f that f hasf anf identical f radius f asf thef front f side. f while f thisf willf notf completely f eliminate f thef lensf efect f off thef front f curved f surface, f itf willf signifcantly f reduce f thef efects. f the f amount f off changef inf thef radia - tionf pattern f isf dependent f uponf thef material f chosenf for f thef window, f thef radius f off thef front f andf backf curves, f andf thef distance f from f thef backf surface f to f thef transceiver. f once f thesef items f are f known, f af lensf design f canf bef madef whichfwillf eliminatefthef efectfoffthef frontf surfacef curve.f f f f f f the f following f drawings f show f the f efects f of f a f curved f window f onf thef radiation f pattern. ff in f allf cases, f thef center f thickness f off thef window f isf 1.5f mm,f thef window f isf madef of f polycarbonate f plastic, f and f the f distance f from f the f transceiver f tofthefbackf surfacefoffthef windowfisf3fmm. 24
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, pte. in the united states and other countries. data subject to change. copyright ? 2006 avago technologies pte. all rights reserved. 5988-9349en - may 29, 2006

▲Up To Search▲

Price & Availability of HSDL-3612-007

	To Download HSDL-3612-007 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .